Solid state image capturing apparatus, camera module and electronic device

ABSTRACT

There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/539,568, filed Nov. 12, 2014, and claims the benefit of JapanesePriority Patent Application JP 2013-239055 filed Nov. 19, 2013, theentire contents of which are incorporated herein by reference.

BACKGROUND

The present technology relates to a solid state image capturingapparatus, a camera module and an electronic device. More particularly,the present technology relates to a solid state image capturingapparatus, a camera module and an electronic device where an IRCF (aninfrared cut filter) is fixed with a metal plate having an opening todecrease a distance to a solid state image capturing apparatus at theback of a lens (LB: lens back) thereby lowering a height of a housing.

SUMMARY

In recent years, a camera module is getting smaller and thinner. Toprovide the thin camera module, a region to which the IRCF is fixed istried to be thin. Until now, the IRCF has been fixed by a moldedproduct.

However, as the molded product has an opening for fixing the IRCFincluding faces to reflect an incident light, a ghost and a flare may begenerated.

Japanese Patent Application Laid-open No. 2012-186434 proposes atechnology that a light shielding region is printed on the surface ofthe IRCF, an end face area of the light shielding region generated at aboundary of an effective pixel range of an image capturing element isreduced to inhibit the incident light from reflecting and the ghost fromgenerating.

However, in the technology in Japanese Patent Application Laid-open No.2012-186434, a peripheral of the opening of the light shielding regionprinted on the surface of the IRCF cannot be thin, the end face forreflecting the incident light is provided thereby generating the ghost,and the opening cannot be small to inhibit the ghost.

In addition, as the opening cannot be small, the flare is generated bywire bonds and the IRCF cannot be small, the IRCF is costly.

Furthermore, when the light shielding region is printed on the IRCF, theIRCF itself remains great, whereby the cost cannot be decreased.

The present technology is provided in consideration of such acircumstance. In particular, by providing and fixing an opening on anetched and blackened metal plate, a lens back is reduced to lower aheight, and a flare and a ghost are inhibited from generating, and bydecreasing a size of the IRCF, a low cost is achieved.

According to an embodiment of the present technology, there is provideda solid state image capturing apparatus including an image capturingelement for photoelectric converting an incident light, a lightshielding filter for shielding a part of the incident light, and a metalplate partly having an opening for fixing the light shielding filter ata position for blocking the opening, ends of the opening of the metalplate being etched and antireflection treated.

The metal plate may have a half-etched step on which the light shieldingfilter is mounted at the end of the opening.

The metal plate may be press bent at the end of the opening.

The metal plate may be adhered to a structure including any of asubstrate with in-built components, a packaged mold, a frame component,a lens unit and an actuator.

The metal plate may be bent partly.

The metal plate may have an adhesive reservoir step for applying anadhesive to fix the light shielding filter.

The step may be formed by half etching or diffusion bonding.

The metal plate may be fixed by adhering the light shielding filter tothe end of the opening.

The light shielding filter may be an IRCF (infrared cut filter).

The antireflection may be by blackening.

The metal plate may be made of an iron-based, an aluminum-based andcopper-based material.

The metal plate may have a plate thickness of about 0.02 mm to 0.05 mm.

The metal plate may have a hole, a concave or a granulated surface forimproving adhesion properties to the structure corresponding to a convexfor positioning disposed on the structure to be adhered.

The metal plate may have a vent.

The metal plate may have a light shielding wall at a peripheral.

According to an embodiment of the present technology, there is provideda camera module including an image capturing element for photoelectricconverting an incident light, a light shielding filter for shielding apart of the incident light, and a metal plate partly having an openingfor fixing the light shielding filter at a position for blocking theopening, an end of the opening of the metal plate being etched andantireflection treated.

According to an embodiment of the present technology, there is providedan electronic device including an image capturing element forphotoelectric converting an incident light, a light shielding filter forshielding a part of the incident light, and a metal plate partly havingan opening for fixing the light shielding filter at a position forblocking the opening, an end of the opening of the metal plate beingetched and antireflection treated.

According to the embodiment of the present technology, the incidentlight is photoelectric converted by the image capturing element, theincident light is partly shielded by the light shielding filter, thelight shielding filter is fixed at a position for blocking the opening,and the end of the opening of the metal plate is etched andantireflection treated.

According to first and second embodiments of the present technology, byfixing the light shielding filter (IRCF) with the metal plate being thinbut having a predetermined strength, the flare and the ghost are reducedby the camera module, the height is lowered and the size of the IRCF isdecreased. Thus, the costs can be reduced.

These and other objects, features and advantages of the presenttechnology will become more apparent in light of the following detaileddescription of best mode embodiments thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B each is a side cross-sectional diagram showing astructure of an embodiment of a camera module to which a solid stateimaging apparatus in the related art is applied;

FIGS. 2A and 2B each is a diagram showing a structure according to afirst embodiment of a camera module to which a solid state imagingapparatus of the present technology is applied;

FIG. 3 is an enlarged diagram for illustrating ends of an opening of ametal plate shown in FIGS. 2A and 2B;

FIG. 4 is a diagram showing a structure according to a second embodimentof a camera module to which a solid state imaging apparatus in therelated art is applied;

FIG. 5 is a diagram showing a structure according to a third embodimentof a camera module to which a solid state imaging apparatus in therelated art is applied;

FIG. 6 is a diagram showing a structure according to a fourth embodimentof a camera module to which a solid state imaging apparatus in therelated art is applied;

FIG. 7 is a diagram showing a structure according to a fifth embodimentof a camera module to which a solid state imaging apparatus in therelated art is applied;

FIG. 8 is a side cross-sectional diagram of a metal plate bent;

FIGS. 9A, 9B and 9C each is a side cross-sectional diagram of a metalplate having an end including an adhesive reservoir of an opening;

FIG. 10 is a diagram for illustrating a relationship between a thicknessand a warp of a metal plate;

FIGS. 11A and 11B each is a diagram for illustrating a camera modulehaving a metal plate including a hole for inserting a positional pin;

FIGS. 12A and 12B each is a diagram for illustrating a camera modulehaving a metal plate including a vent; and

FIG. 13 is a diagram for illustrating a camera module having a metalplate including a light shielding region.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, an embodiment of the present technology will be describedwith reference to the drawings.

The embodiments of the present technology will be described in thefollowing order.

-   1. First Embodiment (where IRCF is fixed on an upper face of a metal    plate)-   2. Second Embodiment (where IRCF is fixed on a lower face of a metal    plate)-   3. Third Embodiment (where half-etched step is disposed at end)-   4. Fourth Embodiment (where an IRCF is adhered to upper face of bent    step at end)-   5. Fifth Embodiment (where an IRCF is adhered to lower face of bent    step at end)-   6. Sixth Embodiment (where adhesive reservoir is disposed at end)

1. First Embodiment Typical Camera Module

FIGS. 1A and 1B each is a side cross-sectional view of a lens and animage capturing element in a typical camera module in the related art.

In detail, as shown in FIG. 1A, the camera module is composed of a lens1, an IRCF (infrared cut filter) 2, molded products 3-1 and 3-2, mountedcomponents 4-1 and 4-2, a substrate 5, an image capturing element 6,wire bonds 7-1 and 7-2 and cylindrical lens units 10-1 and 10-2. Each ofthe lens units 10-1 and 10-2 houses the lens 1. The lens units 10-1 and10-2 are adhered to the molded products 3-1 and 3-2 with adhesives B-1and B-2 directly above the image capturing element 6 on the substrate 5along a light axis of the lens 1.

As to the molded products 3-1 and 3-2, the mounted components 4-1 and4-2, the wire bonds 7-1 and 7-2 and the lens units 10-1 and 10-2, therespective parts are the same in FIGS. 1A and 1B. Hereinafter, unlessotherwise distinguished, they are simply referred to as a molded product3, a mounted component 4, a wire bond 7, a lens unit 10 and others.

The lens 1 transmits an incident light, which is incident on the imagecapturing element 6 via the IRCF 2. The IRCF 2 is fixed by the moldedproduct 3 disposed at the range not inhibiting the incident light fromtransmitting, and removes infrared components contained in the incidentlight.

The image capturing element 6 photoelectrically converts the incidentlight into a pixel signal, and outputs the pixel signal to the substrate5 via wiring of the wire bond 7. More specifically, the image capturingelement 6 has an effective pixel 6 a at a center of a face on which thelight is incident, photoelectrically converts the light incident on theeffective pixel 6 a into a pixel signal and outputs the pixel signal.The mounted component 4 is disposed on the substrate 5, and applies avariety of signal processing to the pixel signal supplied via the wirebond 7 from the image capturing element 6.

In the meantime, in the camera module shown in FIG. 1A, the moldedproduct 3 has a relatively thicker thickness m. For example, thethickness m of the molded product 3 should be about 0.13 mm to 0.2 mm inorder to mold the components stably and fix the IRCF 2 stably. For thisreason, a distance from the lens 1 to the surface of the image capturingelement 6, i.e., a distance T1 of a so-called lens back LB is notshorten. As a result, it is difficult to provide a thin camera module.

Then, according to the technology suggested by the above-describedJapanese Patent Application Laid-open No. 2012-186434, as shown in FIG.1B, the light shielding region 9 is printed on a face opposite to alight incident direction of the IRCF 2 externally to the effective pixel6 a, and fixed on the molded product disposed on the substrate 5,thereby inhibiting the ghost from generating.

However, in the technology in Japanese Patent Application Laid-open No.2012-186434, the thickness of the printed light shielding region 9 formsan end face 9 a, thereby reflecting the incident light. There is alittle chance to generate the ghost. In order not to form the end face 9a on a tip of the light shielding region 9, the end face 9 a is sharpento have an angle exceeding a predetermined angle to the light incidentdirection, which may result in high costs.

Further, in order to inhibit the ghost from generating, the end of thelight shielding region 9 should be positioned apart from the end of theeffective pixel 6 a of the image capturing element 6 a. This may widenthe opening. The incident light may be reflected on the wire bond 7 togenerate the flare.

Alternatively, when the light shielding region 9 is printed on theIRCF2,the IRCF2 should have a size S2greater than a size S1(>S1) shownin FIG. 1A. A large IRCF2 is necessary, which may result in high costs.

<Camera Module to Which the Present Technology is Applied>

FIGS. 2A and 2B each is a diagram showing a structure according to afirst embodiment of a camera module to which a solid state imagingapparatus of the present technology is applied. FIG. 2A is a sidecross-sectional diagram, and FIG. 2B is a top diagram of a metal plate19 as described later. The camera module shown in FIG. 2A includes lensunits 11-1 and 11-2 including a lens 12, an IRCF (infrared cut filter)13, molded products 14-1 and 14-2, a substrate 15, an image capturingelement 16, a wiring (wire bond) 17, mounted components 18-1 and 18-2and metal plates 19-1 and 19-2. In FIG. 2A, although there are the lensunits 11-1 and 11-2, the molded products 14-1 and 14-2 and the metalplates 19-1 and 19-2, the respective parts are a unified structure. Themounted components 18-1 and 18-2 are individual but the same.Hereinafter, the lens units 11-1 and 11-2, the molded products 14-1 and14-2, the mounted components 18-1 and 18-2 and the metal plates 19-1 and19-2 refer simply to as a lens unit 11, a molded product 14, a mountedcomponent 18 and a metal plate 19, unless otherwise distinguished. Thesame applies to other configurations.

The camera module shown in FIGS. 2A and 2B is added to a mobile phone,for example. A light being incident on the lens 12 of the lens unit 11from above in FIG. 2A, is transmitted through the lens 12, and is formedas an image on the image capturing element 16 via the IRCF 13. The imagecapturing element 16 generates a pixel signal by photoelectricconversion based on the image formed, and generates and outputs imagedata based on the pixel signal.

The lens unit 11 is cylindrical. The lens 12 having a cylindrical orprismatic shape housed therein is moved in an up and down direction inFIG. 2A to adjust a focal position, a zoom etc. of the image formed. TheIRCF 13 cuts infrared light among the incident light via the lens 12 andtransmits it to the image capturing element 16. In the lens unit 11shown in FIG. 2A, the lens 12 moves in the up and down direction in FIG.2A, for example. Alternatively, the lens 12 may not move within the lensunit 11 and be a fixed type.

The image capturing element 16 is formed on the substrate 15 on whichwiring etc. are printed, and is electrically connected to wiring printedon the substrate 15 by wirings 17-1 and 17-2 excluding the effectivepixel 16 a of the image capturing element 16. The effective pixel 16 aamong pixels formed on the image capturing element 16 is used togenerate image data configured of captured images. On the imagecapturing element 16, an OPB (optical black) pixel and a connectionterminal receiving signal input/output and electric power supply otherthan the effective pixel 16 a.

The mounted components 18-1 and 18-2 are composed of electric circuitcomponents such as a capacitor, a resistance and an IC (integratedcircuit), are disposed at a predetermined position on the substrate 15,and is electrically connected thereto. Although the mounted components18-1 and 18-2 etc. are present on the substrate 15, the mountedcomponents 18-1 and 18-2 may not necessarily being present on thesubstrate.

The molded products 14-1 and 14-2 are disposed at the height such thatthe IRCF 13 can be fixed on an upper face of the image capturing element16 at an adequate height and the metal plate 19 is adhered and fixedthereon. Although the molded product 14 is configured independently inFIG. 2A, the molded product 14 may include the mounted components asshown in FIG. 5 as described later.

The metal plate 19 is an etched metal plate, and has a disk shape shownin FIG. 2B viewed from the light incident direction. Alternatively, themetal plate 19 may have a shape other than the disk, for example, may besquare or other shapes. The metal shape 19 has an opening at asubstantially center to fix the IRCF 13 directly above the effectivepixel 16 a of the image capturing element 16. The IRCF 13 is a filterfor shielding infrared light which is a part of the incident light, andis adhered and fixed with an adhesive in conformity with the opening toblock the whole of the opening. Ends 19 a-1 and 19 a-2 of the opening inthe metal plate 19 are formed to have sharp shapes by etching, and areformed on faces having angles greater than predetermined angles to thelight incident direction. In addition, the end 19 a is antireflectiontreated and therefore has the structure that the incident light is hardto be reflected. Accordingly, the metal plate 19 functions as a regionto fix the IRCF 13 on the image capturing element 16, functions as alight shielding region not to reflect the incident light on the wiring17 of the wire bond, and also functions to decrease the flare generatedby the reflection from the wiring 17 of the wire bond.

The metal plate 19 is etched by using a ferric chloride solution at aconstant temperature (for example, 20 °C.). The metal plate 19 is madeof an iron-based, an aluminum-based and copper-based material, forexample, SUS-based (SUS 304-based or SUS 630-based) material. Theantireflection treatment is a blackening treatment such as a blackcoating treatment (black chromium plating) and a black painting. Notethat a paint film by the black painting is thicker than a black coatingfilm. Accordingly, the black coating treatment can provide a thinnerconfiguration, which is hard to generate the end face for reflecting theincident light, thereby decreasing the ghost at high precision.

For this reason, the end face for reflecting a part of the incidentlight in a direction of the image capturing element 16 is not formed atthe end face 19 a of the metal plate 19, and the incident light isabsorbed because of the antireflection treatment. As a result, it ispossible to inhibit the ghost from generating, as the ghost is generatedby reflecting the incident light on the end face of the end of theopening.

As shown in FIG. 3, the metal plate 19 has high stiffness and can betherefore thinner than the molded product to reduce the lens back LB,whereby the camera module can be thinner as a whole. Also, as the lensback LB is reduced, an optical design freedom is increased to improveoptical properties.

Furthermore, as shown in FIG. 3, the end 19 a is etched to have a shapershape, the opening of the metal plate 19 can be small close to a size ofthe effective pixel 16 a of the image capturing element 16, and a size dof the IRCF 13 can be decreased, thereby reducing the costs of the IRCF13. In the end 19 a of the opening in the metal plate 19, no end facefor reflecting the incident light is formed. The end 19 a functions as alight shielding wall to an edge of the end of the effective pixel 16 a.FIG. 3 is an enlarged diagram of the side cross-sectional view of FIG.2A around the end 19 a of the metal plate 19, and show the lens back LBand the size d of the IRCF 13.

The lens unit 11 is adhered to an upper face of the metal plate 19adhered to the molded product 14 by each of adhesives B1-1 and B1-2.

The camera module shown in FIG. 2A can be considered to be composed of asolid state image capturing apparatus package surrounded by the IRCF 13,the molded product 14 and the substrate 15; and the lens unit 11. Inother words, the camera module can have a variety of optical propertiescorresponding to kinds of the lens 12 of the lens unit 11 by acombination of the solid state image capturing apparatus package and thelens unit.

2. Second Embodiment

In the embodiment above, the IRCF 13 is adhered above the opening of themetal plate 19. Alternatively, the IRCF 13 may be adhered under theopening of the metal plate 19.

FIG. 4 is a diagram showing a camera module where the IRCF 13 is adheredunder the opening of the metal plate 19. In FIG. 4, the componentsalready described in FIGS. 2A and 2B are denoted by the same name andthe same reference numerals, and thus detailed description thereof willbe hereinafter omitted.

In other words, as shown in FIG. 4, the lens unit 11 is adhered to thesubstrate 15 with each of the adhesives B1-1 and B1-2, the metal plate19 is adhered to a bottom face of the lens unit 11, and the IRCF 13 isadhered under the opening of the metal plate 19.

The configuration shown in FIG. 4 can also provide advantages similar tothe camera module shown in FIG. 2.

3. Third Embodiment

In the embodiment above, the opening in the metal plate 19 is formed tobe thin and have sharp shapes by etching. Alternatively, by half-etchingthe end of the opening in the metal plate 19, the end may be formed tobe thin and have sharp shape, and a step may be provided to adhere theIRCF 13.

FIG. 5 shows a camera module where the ends 19 b-1 and 19 b-2 having ahalf-etched step on the opening of the metal plate 19. In FIG. 5, thecomponents already described in FIGS. 2A and 2B are denoted by the samename and the same reference numerals, and thus detailed descriptionthereof will be hereinafter omitted.

In other words, as shown in FIG. 5, in the end 19 b of the metal plate19, a half-etched step is provided to adhere the IRCF 13 upward, and theIRCF 13 is fixed to an upper face of the step provided in the end 19 b.According to such a configuration, even if the metal plate 19 issomewhat thick, the end 19 b to which the IRCF 13 is fixed is sharp andthin by half-etching and the step for fixing the IRCF 13 is provided,thereby decreasing the lens back. The configuration shown in FIG. 5 canalso provide advantages similar to the camera module shown in FIG. 2.

In FIG. 5, the molded product 14-1 includes the mounted component 18.Although the molded product 14 may include the mounted component, asubstrate with in-built components, a packaged mold, a frame component,a lens unit and an actuator may be used instead of the molded product14.

Although FIG. 5 shows the end 19 b having the step for fixing the IRCF13 on the upper face of the metal plate 19 by half-etching, the end 19 bhaving the step for fixing the IRCF 13 may be provided on the lower faceof the metal plate 19 such that the IRCF 13 may be fixed on the lowerface of the metal plate 19 with the adhesive.

4. Fourth Embodiment

In the embodiment above, the half-etched step is provided to the openingin the metal plate 19. Alternatively, the step for adhering the IRCF 13may be provided by press bending after the end of the opening in themetal plate 19 is etched.

FIG. 6 is a diagram showing a camera module having the stepped ends 19c-1 and 19 c-2 by press bending on the opening of the metal plate 19. InFIG. 6, the components already described in FIGS. 2A and 2B are denotedby the same name and the same reference numerals, and thus detaileddescription thereof will be hereinafter omitted.

In other words, as shown in FIG. 6, the end 19 c of the metal plate 19is press bent to have the step, and the IRCF 13 is fixed to a face onwhich the step of the end 19 c is provided. As the end 19 c to which theIRCF 13 is fixed is sharp and thin by etching, the ghost is inhibited,the lens back can be decreased, and the IRCF 13 can be smaller. As aresult, advantages can also be provided similar to the camera moduleshown in FIG. 2.

5. Fifth Embodiment

In the embodiment above, after the opening is etched in the metal plate19, the end having the step by press bending is provided to fix the IRCF13 on the metal plate 19. Alternatively, after the opening is etched inthe metal plate 19, the end 19 c having the step by press bending isprovided to adhere the IRCF 13 on the lower face of the step.

FIG. 7 shows a camera module having stepped ends 19 d-1 and 19 d-2 bypress bending on the opening of the metal plate 19, and the IRCF 13 isadhered to a lower face of the step. In FIG. 7, the components alreadydescribed in FIGS. 2A and 2B are denoted by the same name and the samereference numerals, and thus detailed description thereof will behereinafter omitted.

In other words, as shown in FIG. 7, the end 19 d of the metal plate 19is press bent to have the step, and the IRCF 13 is fixed to the lowerface of the step of the end 19 d.

As the end 19 d to which the IRCF 13 is fixed is sharp and thin byetching, the ghost is inhibited, the lens back can be decreased, and theIRCF 13 can be smaller. As a result, advantages can also be providedsimilar to the camera module shown in FIG. 2.

Concaves in Metal Plate

The metal plate 19 may be bent a part or a whole thereof to provideconcaves 19 e, thereby improve stiffness, as shown in a sidecross-sectional diagram of FIG. 8.

6. Sixth Embodiment

Furthermore, the opening of the metal plate 19 may include an end 19 fhaving an adhesive reservoir step for reserving each of adhesives B11-1and B11-2 used for adhering the IRCF 13, as shown in FIG. 9A. In thismanner, the adhesive B11 for adhering the IRCF 13 on an adhesive face ispressed to be squeezed on the IRCF 13 when the IRCF 13 is adhered to themetal plate 19, whereby the end face for reflecting the incident lightis prevented from generating. As a result, the ghost can be inhibitedfrom generating.

The end 19 f having the adhesive reservoir step for reserving theadhesive B11-1 may be formed by half-etching. In addition, the end 19 fmay be formed by diffusion bonding of two metal plates 19 x and 19 y asshown in FIG. 9C.

Thickness of Metal Plate

The metal plate should have a predetermined thickness that does notinterfere with other configurations caused by a deflection generatedupon falling.

Tables 1 and 2 each shows a simulated result showing a relationshipbetween a plate thickness ( 0.06 to 0.01 mm) and a deflection (openingdeflection upon falling) when the material of the metal plate 19 is SUS304 based and C2801 based material. Here, the deflection is measured inpositive and negative directions of the metal plate 19 at a height Hdirectly above the wire bond WB where interference is most easilygenerated, as shown in FIG. 10. In the simulation, an impact value uponfalling is added.

TABLE 1 Opening Plate deflection thickness upon falling Total 0.06 +0.009 0.069 0.05 + 0.012 0.062 0.04 + 0.019 0.059 0.03 + 0.025 0.0550.02 + 0.051 0.071 0.01 + 0.180 0.200

TABLE 2 Opening Plate deflection thickness upon falling Total 0.06 +0.013 0.073 0.05 + 0.021 0.071 0.04 + 0.026 0.066 0.035 + 0.030 0.0650.03 + 0.036 0.066 0.02 + 0.069 0.089 0.01 + 0.290 0.300

In other words, when the material of the metal plate 19 is SUS 304 basedmaterial and the plate thickness is 0.06 mm, the deflection is 0.009 mm,which totals 0.069 mm taking interference generation into consideration;when the plate thickness is 0.05 mm, the deflection is 0.012 mm, whichtotals 0.062 mm taking interference generation into consideration.Similarly, when the plate thickness is 0.04 mm, the deflection is 0.019mm, which totals 0.059 mm; when the plate thickness is 0.03 mm, thedeflection is 0.025 mm, which totals 0.055 mm; when the plate thicknessis 0.02 mm, the deflection is 0.051 mm, which totals 0.071 mm; when theplate thickness is 0.01 mm, the deflection is 0.180 mm, which totals 0.2mm. In view of the above, when the material of the metal plate 19 is SUS304 based material, a most suitable thickness is 0.03 mm where the totalof the deflection and the thickness is smallest.

When the material of the metal plate 19 is copper based C2801 materialand the plate thickness is 0.06 mm, the deflection is 0.013 mm, whichtotals 0.073 mm taking interference generation into consideration; whenthe plate thickness is 0.05 mm, the deflection is 0.021 mm, which totals0.071 mm taking interference generation into consideration. Similarly,when the plate thickness is 0.04 mm, the deflection is 0.026 mm, whichtotals 0.066 mm; when the plate thickness is 0.035 mm, the deflection is0.030 mm, which totals 0.055 mm; when the plate thickness is 0.03 mm,the deflection is 0.036 mm, which totals 0.066 mm; when the platethickness is 0.02 mm, the deflection is 0.069 mm, which totals 0.089 mm;when the plate thickness is 0.01 mm, the deflection is 0.290 mm, whichtotals 0.3 mm. In view of the above, when the material of the metalplate 19 is C2801P based material, a most suitable thickness is 0.035 mmwhere the total of the deflection and the thickness is smallest.

As shown in FIG. 10, from the standpoint of the relationship between theplate thickness and the deflection of the metal plate 19, an appropriatethickness of the metal plate 19 is about 0.02 to 0.05 mm. Therelationship between the plate thickness and the deflection shown inFIG. 10 is based on the condition that the IRCF 13 is directly fixed tothe end of the opening.

Holes for Alignment

As shown in FIGS. 11A and 11B, a positioning pin 14 a is disposed on themolded product 14 and holes 19 h corresponding to the positioning pin 14a are disposed on the metal plate 19, which may be used for alignmentwhen the metal plate 19 is mounted on the molded product 14.

In other words, by such a configuration, a convex positioning pin 14 ais positioned to insert to the holes 19 h in a step of mounting themetal plate 19, thereby improving work efficiency and determining thealignment accuracy. Although the convex positioning pin 14 a is providedcorresponding to the holes 19 h in FIG. 11A, other convex shapes forlocking the holes 19 h or a granulated surface may be provided eventhough they are not inserted into the holes 19 but they can position themetal plate 19 at a fixed position. Instead of the holes 19 h, concavesmay be provided. Furthermore, although twelve holes 19 h are shown intotal in FIG. 11A, the holes 19 h may be any number. As long as thepositioning can be made, the holes 19 h may be provided at a positionexcluding the position shown in FIG. 11.

Vent

In the meantime, as a space is provided between the metal plate 19 andthe image capturing element 16, the IRCF 13 and the image capturingelement 16 may be fogged by a rapid change in temperature or humidity.Then, as shown in FIGS. 12A and 12B, there may be provided a vent 19 jfor ventilating air within the space between the metal plate 19 and theimage capturing element 16 to the external.

By providing the vent 19 j, the air within the space between the metalplate 19 and the image capturing element 16 can be ventilated to theexternal, thereby inhibiting the IRCF 13 and the image capturing element16 from fogging. A diameter of the vent 19 j is desirably very small sothat the image capturing element 16 is not contaminated.

Light Shielding Wall

In the embodiment above, the end of the opening in the metal plate 19 isetched or half-etched. Alternatively, a peripheral end may be pressed tobend in a perpendicular direction, thereby forming a light shieldingwall, as shown in FIG. 13.

In other words, as shown in FIG. 13, pressing the peripheral end to bendin the perpendicular direction and to form a light shielding wall 19 kallows the light incident on the image capturing element 16 from a spacewithin the lens unit 11 to be shielded and inhibits a noise fromgenerating.

The present technology is not limited to the above-describedembodiments, and variations and modifications may be made withoutdeparting from the scope of the present technology.

The present technology may have the following configurations.

(1) A solid state image capturing apparatus, including:

an image capturing element for photoelectric converting an incidentlight;

a light shielding filter for shielding a part of the incident light; and

a metal plate partly having an opening for fixing the light shieldingfilter at a position for blocking the opening,

an end of the opening of the metal plate being etched and antireflectiontreated.

(2) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate has a half-etched step on which the light shieldingfilter is mounted at the end of the opening.

(3) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate is press bent at the end of the opening.

(4) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate is adhered to a structure including any of a substratewith in-built components, a packaged mold, a frame component, a lensunit and an actuator.

(5) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate may be bent partly.

(6) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate has an adhesive reservoir step for applying an adhesiveto fix the light shielding filter.

(7) The solid state image capturing apparatus according to (6) above, inwhich

the step is formed by half etching or diffusion bonding.

(8) The solid state image capturing apparatus according to (1) above, inwhich

the metal plate is fixed by adhering the light shielding filter to theend of the opening.

(9) The solid state image capturing apparatus according to any of (1) to(8) above, in which

the light shielding filter is an IRCF (infrared cut filter).

(10) The solid state image capturing apparatus according to any of (1)to (9) above, in which

the antireflection is by blackening.

(11) The solid state image capturing apparatus according to any of (1)to (10) above, in which

the metal plate is made of an iron-based, an aluminum-based andcopper-based material.

(12) The solid state image capturing apparatus according to any of (1)to (11) above, in which

the metal plate has a plate thickness of about 0.02 mm to 0.05 mm.

(13) The solid state image capturing apparatus according to any of (1)to (13) above, in which

the metal plate has a hole, a concave or a granulated surfacecorresponding to a convex for positioning disposed on the structure tobe adhered.

(14) The solid state image capturing apparatus according to any of (1)to (13) above, in which

the metal plate has a vent.

(15) The solid state image capturing apparatus according to any of (1)to (14) above, in which

the metal plate has a light shielding wall at a peripheral.

(16) A camera module, including:

an image capturing element for photoelectric converting an incidentlight;

a light shielding filter for shielding a part of the incident light; and

a metal plate partly having an opening for fixing the light shieldingfilter at a position for blocking the opening,

an end of the opening of the metal plate being etched and antireflectiontreated.

(17) An electronic device, including:

an image capturing element for photoelectric converting an incidentlight;

a light shielding filter for shielding a part of the incident light; and

a metal plate partly having an opening for fixing the light shieldingfilter at a position for blocking the opening,

an end of the opening of the metal plate being etched and antireflectiontreated.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A solid state image capturing apparatus,comprising: an image capturing element, wherein the image capturingelement is operable to generate a signal by photoelectrically convertingincident light; a light shielding filter, wherein the light shieldingfilter shields a part of the incident light; and a light shieldingmember having an opening, wherein the light shielding member holds thelight shielding filter over the opening, wherein the opening has aninclined surface such that a lower diameter of the opening is largerthan an upper diameter of the opening, wherein the light shieldingmember has a step above the inclined surface, and wherein the lightshielding filter is adhered to the step by an adhesive.
 2. The solidstate image capturing apparatus according to claim 1, wherein the lightshielding member has a light shielding wall at a peripheral portion ofthe light shielding member.
 3. The solid state image capturing apparatusaccording to claim 2, wherein the light shielding wall is perpendicularto a top surface of a remaining portion of light shielding member andextends from the top surface of the remaining portion in a directionaway from the image capturing element.
 4. The solid state imagecapturing apparatus according to claim 1, wherein an end of the openingis antireflection treated.
 5. The solid state image capturing apparatusaccording to claim 1, wherein the light shielding member is adhered to astructure including any of a substrate with in-built components, apackaged mold, a frame component, a lens unit, and an actuator.
 6. Thesolid state image capturing apparatus according to claim 1, wherein thelight shielding filter is an IRCF (infrared cut filter).
 7. The solidstate image capturing apparatus according to claim 1, wherein theopening is antireflection treated by blackening.
 8. The solid stateimage capturing apparatus according to claim 1, wherein the lightshielding member has a plate thickness of over 0.02 mm.
 9. The solidstate image capturing apparatus according to claim 4, wherein the lightshielding member has a light shielding wall at a peripheral portion ofthe light shielding member.
 10. A camera module, comprising: a lens; asubstrate; wiring printed on the substrate; wirings; an image capturingelement, wherein the image capturing element is on a surface of thesubstrate and is connected to the wiring printed on the substrate by thewirings, and wherein the image capturing element is operable to generatea signal by photoelectrically converting incident light; a lightshielding filter, wherein the light shielding filter shields a part ofthe incident light; and a light shielding member having an opening,wherein the light shielding member holds the light shielding filter overthe opening, wherein the opening has an inclined surface such that alower diameter of the opening is larger than an upper diameter of theopening, wherein the light shielding member has a step on a side of thelight shielding member that is opposite the side on having the inclinedsurface, and wherein the light shielding filter is adhered to the stepby an adhesive.
 11. An electronic device, comprising: a substrate; animage capturing element, wherein the image capturing element is mountedon the substrate, and wherein the image capturing element is operable togenerate a signal by photoelectrically converting incident light; alight shielding filter, wherein the light shielding filter shields apart of the incident light; and a light shielding member having anopening, wherein the light shielding member holds the light shieldingfilter over the opening, wherein the opening has an inclined surfacesuch that a lower diameter of the opening is larger than an upperdiameter of the opening, wherein the light shielding member has a stepon a side of the light shielding member that is opposite the side onhaving the inclined surface, and wherein the light shielding filter isadhered to the step by an adhesive.